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Himax Begins Shipping Wafer-Level Optics Technology for iPhone X's Face ID

Fabless semiconductor company Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources (via DigiTimes). The solution is reportedly a key component of the Face ID facial authentication sensor exclusive to the upcoming iPhone X.

ChipMOS Technologies will also see revenues generated from orders for WLO chips increase substantially later in 2017 as the backend house has cut into the supply chain for the iPhone X by partnering with Himax, said the sources. ChipMOS' revenues from orders for WLO chips are expected...

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Published By: MacRumors - Thursday, 12 October